E-beam Evaporator and Thermal Evaporator for Metals
The first evaporator system will be used for the deposition of metals. Two sources of evaporation will be used, one e-beam evaporator with multiple pockets and one thermal evaporator. The tool will be used to evaporate single films, layers of multiple films and alloys. High electrical conductivity and purity of deposited metals is required.
Some Key features of the tool:
- Single Metals Layers: Al, Au, Pt, Pd, Ag, Ti, Cr, Ru, Ni, Co.
- Co-deposition of metals for alloys such as FeNi.
- Thicknesses from 5-500nm in a single growth run. Uniformity at least ±7% across an 8-inch wafer.
- Base pressure better than 7×10-7 Torr
